In the microwave field, Raytron is capable of providing customers with silicon-based and compound-based MMIC chips, RF front-end chips and modules, T/R components and micro-assembly foundry services. The Company can also provide phased array antennas as well as other microsystem and subsystem products and solutions for customers in need, addressing the application requirements in terrestrial wireless communication, satellite communication, low-altitude and ground surveillance radar for civil purpose.
It covers two series of chips: analog beamforming (ABF) chips and digital beamforming (DBF) chips. In terms of ABF chips, Raytron is capable of designing multi-channel and multi-beam ABF chips in C/X/Ku/Ka/E/W bands featuring low power consumption and high integration. In terms of DBF chips, Raytron is capable of designing ultra-wideband ADC/DAC, PLL, mixer and other core circuits featuring low power consumption and ultra-high speed.
On the foundation of advanced GaAs and GaN epitaxial materials, devices and processes, the Company has mastered C/X/Ku/Ka-band T/R MMIC chipsets, ultra-wideband amplifier MMIC chips, low-noise amplifier MMIC chips, high-power and high-efficiency GaN power amplifier MMIC chips and other technologies.
The Company has mastered the simulation and design technologies for micro-assembly-based brick and short-brick T/R components and tile T/R components, as well as the design technology for micro-system-based SiP ultra-small T/R components.
Based on Raytron’s proprietary core chips, components and modules, the Company can provide customers with comprehensive and miniaturized phased array antenna integration solutions and products, including antenna design, T/R design, MMIC chipset solutions, feed design, wave-control power supply design, and structural heat dissipation design.
Raytron is specialized in R&D and manufacturing of chips, components and phased array microsystems in the microwave and millimeter wave bands. The Company is in possession of well-established RF/microwave/millimeter wave test platforms, high-frequency chip packaging platforms, reliability verification platforms, as well as the following facilities: a standardized micro-assembly line for R&D purposes, an automated micro-assembly production line with an annual capacity of up to 200,000 channels, a highly reliable aerospace-grade micro-assembly production line, a chip post-processing line for R&D tests and small-scale shipments, a far-field an echoic chamber with an effective testing distance of 12m, and a near-field an echoic chamber capable of testing antennas with a diameter of 1.5m.
